The emerge of Mini LED to be used in backlight application started in 2018. Then at the beginning of 2021, Epistar and Lextar had jointly established a joint venture Ennostar Incorporation (TW stock code 3714) to announce the new era of mini LED.

Since 2019, Epistar have begun to put mini LED chip into production and they have chosen ProLight Opto as their mini LED packaging manufacturer. Due to Mini LED being less than 100 µm in size, so the key to ensure chip can be placed on substrate and have high yield rate when implanting millions of units rely heavily on the packaging process and technology. Because of this, ProLight Opto cooperated with Epistar and a material manufacturer in Japan in developing a unique bonding material together with an advanced production process, which have made ProLight to become the world’s first mini LED packaging factory able to mass production huge number of mini LEDs.

ProLight as a professional mini LED packaging manufacturer have exclusive advantages: 1. 100% flip chip technology, wireless bonding to create extreme small package size. 2. Unique glue material improves light penetration rate, 3. High reliability, failure rate < 20 ppm.

Mini LED series include 0404 package, the smallest RGB in one package size and it is suitable for high resolution indoor display; 1111 package with IC inside is suitable for transparent display. 0302 package, the smallest package size in the industry for back light applications.